Tata Electronics and Intel
♦ Tata Electronics and Intel have signed a memorandum of understanding (MoU) to explore the possiblity of manufacturing and packaging of Intel’s products for Indian markets. As part of the MoU, Tata Electronics will look at options of manufacturing Intel’s products at the former’s chip fabrication unit at Dholera as well as packaging some of Intel’s chips at the Guwahati Outsourced Semiconductor Assembly and Test (OSAT) facility. ♦ The two companies will also look to collaborate for “advanced packaging in India”. Further, the two companies will also explore the possibility of scaling artificial intelligence (AI) personal computer solutions for the consumer and enterprise markets in India.